| 制造商 | 部件名 | 数据表 | 功能描述 |
Belden Inc. |
8775.060100
|
170Kb/2P
|
Audio, Control & Instrument, #22-11pr, PP, Indiv. Foil, PVC Jkt, CM
01-20-2023
|
|
8775.0601000
|
170Kb/2P
|
Audio, Control & Instrument, #22-11pr, PP, Indiv. Foil, PVC Jkt, CM
01-20-2023
|
|
8775.060500
|
170Kb/2P
|
Audio, Control & Instrument, #22-11pr, PP, Indiv. Foil, PVC Jkt, CM
01-20-2023
|
Molex Electronics Ltd. |
87754-0552
|
194Kb/4P
|
2.00mm (.079) Pitch Header, Breakaway, Right Angle, Through Hole, Vertical, 5 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
87755-0800
|
101Kb/3P
|
2.00mm (.079") Pitch PCB Header, Through Hole, Single Row Dual Body, Vertical, 8 Circuits
|
|
87758-0014
|
195Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-0216
|
182Kb/4P
|
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 2 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0217
|
182Kb/4P
|
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 2 Circuits, 0.76um (30u") Gold (Au) Selective Plating
|
|
87758-0416
|
182Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0417
|
182Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0450
|
147Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-0616
|
182Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 6 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0617
|
182Kb/4P
|
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 6 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0650
|
147Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-0816
|
182Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0817
|
182Kb/4P
|
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 8 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0850
|
147Kb/4P
|
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 8 Circuits, 0.38um (15u") Gold (Au) Selective Plating
|
|
87758-1017
|
182Kb/4P
|
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 10 Circuits
|
|
87758-1050
|
147Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-1216
|
182Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
Chinese ▼ 
English
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand