| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd. |
87920-0830
|
1Mb/12P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
|
|
87920-0833
|
1Mb/16P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap, without Peg
|
|
87920-2003
|
1Mb/16P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap, without Peg
|
|
87920-8115
|
1Mb/13P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
|
|
87920-8147
|
1Mb/13P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tube Packaging
|
|
87920-9047
|
1Mb/13P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 2.50關m (98關) Tin (Sn) Plating, without Cap, with Peg, Tube Packaging, Lead-free
|
|
87920-9311
|
1Mb/13P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Overall Plating, with Cap, without Peg, Tape on Reel Packaging, Lead-free
|
|
87920-9346
|
1Mb/13P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Overall Plating, without Cap, without Peg, Tube Packaging, Lead-free
|
|
87925-2000
|
225Kb/4P
|
5.08mm (.200) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus??Pa-S Receptacle, Press-fit, Vertical, Power Alpha 24, Signal 10
|
|
87925-3000
|
199Kb/4P
|
6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus??Pa-S Receptacle, Press-fit, Vertical, 0.76關m (30關) Gold (Au)Plating, 33 Circuits
|
TE Connectivity Ltd |
879287-3
|
823Kb/1P
|
TOLERANCES UNLESS OTHERWISE SPECIFIED:
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