制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd. |
87933-1007
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355Kb/7P
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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
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87933-1211
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355Kb/7P
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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
|
87933-1215
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355Kb/7P
|
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
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87933-1217
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355Kb/7P
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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76關m (30關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
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87933-3015
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355Kb/7P
|
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
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87933-5031
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174Kb/4P
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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120)
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87937-0106
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102Kb/3P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
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87937-0406
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102Kb/3P
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2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
87937-0502
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102Kb/3P
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2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
87937-0600
|
194Kb/4P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 6 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
|
87937-0800
|
194Kb/4P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 12.00mm (.472) Stacking Height
|
87937-0801
|
194Kb/4P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75關m (29關) Gold (Au) Plating, 10.90mm (.429) Stacking Height
|
87937-0802
|
102Kb/3P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
87937-1206
|
102Kb/3P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
87937-1600
|
195Kb/4P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height
|
87937-1601
|
195Kb/4P
|
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 19.05mm (.750) Stacking Height
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87938-0002
|
163Kb/4P
|
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Single Row Dual Body, Vertical, 8 Circuits, Gold (Au) Selective Plating, 8.07mm (.318) Stacking Height
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87939-0001
|
103Kb/3P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
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87939-2000
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333Kb/6P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50關m (100關) Tin (Sn) Plating, 15.35mm(.604) Stacking Height
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87939-4001
|
334Kb/6P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 6.40mm(.251)
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