The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP, and 48-ball µBGA* packages. ■ Flexible SmartVoltage Technology - 2.7 V–3.6 V Read/Program/Erase - 2.7 V or 1.65 V I/O Option Reduces Overall System Power - 12 V for Fast Production Programming ■ High Performance - 2.7 V–3.6 V: 90 ns Max Access Time - 3.0 V–3.6 V: 80 ns Max Access Time ■ Optimized Architecture for Code Plus Data Storage - Eight 8-Kbyte Blocks, Top or Bottom Locations - Up to Sixty-Three 64-KB Blocks - Fast Program Suspend Capability - Fast Erase Suspend Capability ■ Flexible Block Locking - Lock/Unlock Any Block - Full Protection on Power-Up - WP# Pin for Hardware Block Protection - VPP = GND Option - VCC Lockout Voltage ■ Low Power Consumption - 9 mA Typical Read Power - 10 µA Typical Standby Power with Automatic Power Savings Feature ■ Extended Temperature Operation - –40 °C to +85 °C ■ Easy-12 V - Faster Production Programming - No Additional System Logic ■ 128-bit Protection Register - 64-bit Unique Device Identifier - 64-bit User Programmable OTP Cells ■ Extended Cycling Capability - Minimum 100,000 Block Erase Cycles ■ Flash Data Integrator Software - Flash Memory Manager - System Interrupt Manager - Supports Parameter Storage, Streaming Data (e.g., voice) ■ Automated Word/Byte Program and Block Erase - Command User Interface - Status Registers ■ SRAM-Compatible Write Interface ■ Cross-Compatible Command Support - Intel Basic Command Set - Common Flash Interface ■ x 16 for High Performance - 48-Ball µBGA* Package - 48-Lead TSOP Package ■ x 8 I/O for Space Savings - 48-Ball µBGA* Package - 40-Lead TSOP Package ■ 0.25 µ ETOX™ VI Flash Technology
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