制造商 | 部件名 | 数据表 | 功能描述 |
Taiyo Yuden (U.S.A.), I... |
BRL2012T2R2MD6
|
138Kb/1P
|
Wire-wound Chip Power Inductors
|
BRL2012T2R2MD6
|
281Kb/3P
|
Wire-wound Chip Power Inductors (BR series)[BRL]
|
BRL2012T2R2MD6
|
354Kb/3P
|
Wire-wound Ferrite Power Inductors LSQPB series for General Electronic Equipment
2021/8/3
|
LSQPB201210T2R2MD6
|
354Kb/3P
|
Wire-wound Ferrite Power Inductors LSQPB series for General Electronic Equipment
2021/8/3
|
Search Partnumber :
Start with "2MD6" -
Total : 100 ( 1/5 Page) |
RMT Ltd. |
2MD04-014-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
2MD04-014-05
|
2Mb/8P |
Blank ceramics (not metallized)
|
2MD04-014-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
2MD04-014-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
2MD04-014-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
2MD04-014-10
|
2Mb/8P |
Blank ceramics (not metallized)
|
2MD04-014-12
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
2MD04-014-12
|
2Mb/8P |
Blank ceramics (not metallized)
|
2MD04-014-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
2MD04-014-15
|
2Mb/8P |
Blank ceramics (not metallized)
|
2MD04-022-05
|
334Kb/4P |
Thermoelectric Module
|
2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized)
|
2MD04-022-05-1
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
2MD04-022-05/1
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2Mb/8P |
Blank ceramics (not metallized)
|
2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|